SPICE Thermal Model
REV January 2004
FDP14AN06LA0T
CTHERM1 TH 6 2.5e-3
CTHERM2 6 5 3e-3
CTHERM3 5 4 4e-3
CTHERM4 4 3 7e-3
RTHERM1
th
JUNCTION
CTHERM1
CTHERM5 3 2 8.2e-3
CTHERM6 2 TL 5e-2
6
RTHERM1 TH 6 4.2e-2
RTHERM2 6 5 8.4e-2
RTHERM3 5 4 1.04e-1
RTHERM4 4 3 1.14e-1
RTHERM2
CTHERM2
RTHERM5 3 2 2.74e-1
RTHERM6 2 TL 3.44e-1
5
SABER Thermal Model
SABER thermal model FDP14AN06LA0T
template thermal_model th tl
thermal_c th, tl
{
ctherm.ctherm1 th 6 =2.5e-3
ctherm.ctherm2 6 5 =3e-3
ctherm.ctherm3 5 4 =4e-3
ctherm.ctherm4 4 3 =7e-3
RTHERM3
RTHERM4
4
CTHERM3
CTHERM4
ctherm.ctherm5 3 2 =8.2e-3
ctherm.ctherm6 2 tl =5e-2
3
rtherm.rtherm1 th 6 =4.2e-2
rtherm.rtherm2 6 5 =8.4e-2
rtherm.rtherm3 5 4 =1.04e-1
rtherm.rtherm4 4 3 =1.14e-1
rtherm.rtherm5 3 2 =2.74e-1
rtherm.rtherm6 2 tl =3.44e-1
RTHERM5
CTHERM5
}
RTHERM6
2
CTHERM6
?2010 Fairchild Semiconductor Corporation
tl
CASE
FDB14AN06LA0_F085 Rev. C
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